| Logic | Hisilicon | Kirin 960 | Kirin 960 8-Core ARM 4*Cortex A73 2.4GHz+4*Cortex A53 1.8GHz Application Processor and Baseband Processor |
| Memory | Samsung | KM3H6001CM | LPDDR4 48Gb DRAM |
| Memory | Samsung | KMQ310013B | 64GB NAND Flash |
| PM | Hisilicon | Hi6523 | Power Management |
| PM | TI | LM36923H | Highly Efficient Triple-String White LED Driver |
| PM | N/A | N/A | Configurable Load Switch-Reset Timer |
| PM | Hisilicon | Hi6422 | Power Management |
| PM | intersil | ISL91110 | High Efficiency Buck-Boost Regulator with 4.5A Switches |
| PM | Hisilicon | Hi6421 | Power Management |
| PM | TI | DRV2605 | Haptic Driver for ERM/LRA with Built-In Library and Smart Loop Architecture |
| PM | TI | TPS61256 | 3.5-MHz High Efficiency Step-Up Converter In Chip Scale Packaging. 5V Output Voltage |
| RF | Broadcom | BCM47531A1 | Integrated Monolithic GPS、GLONASS、BeiDou and QZSS Receiver IC |
| RF | Broadcom | BCM43455XKUBG | 5G WiFi/BT |
| RF | Hisilicon | Hi6362 | RF Receiver |
| RF | N/A | N/A | RF Module |
| RF | RFMD | RF5216 | Quad-Band GSM, Linear EDGE Transmit Module with Fourteen High Linearity TRX Switch Ports |
| RF | RFMD | RF1643 | RF Switch |
| RF | NXP | N/A | NFC Controller |
| Sensor | N/A | N/A | Fingerprint Sensor |
| Sensor | STMicroelectronics | LSM6DS3 | 6-Axis Accelerometer + Gyroscope |
| Sensor | AKM | AK09911 | 3-Axis Electronic Compass |
總結：
整機採用2種共15顆螺絲固定，手機內通過硅脂、石墨片散熱。電池通過三條雙面膠固定，未使用易拉膠，難於拆解和更換，手機在開口處都帶有防水設計。芯片方面，手機的處理器、基帶、電源管理芯片都是使用華為旗下海思品牌的芯片。
產品技術分析服務：
一：整機分析報告：產品技術亮點、參數信息、包裝規格、整機外觀、拆解步驟、主板/軟板分析、電池/攝像頭/顯示屏分析、成本參考信息。
二：IC器件分析報告：封裝級分析、器件工藝分析、材料結構分析、可靠性/失效實驗。
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