魅族Pro 6 Plus拆解,外殼全金屬打造

Logic

Samsung

Exynos 8890

8-Core Application Processor and Baseband Processor

Memory

Samsung

KLUCG4J1CB

64GB ROM

Memory

Samsung

K3RG2G20CM-CGCJ

4GB RAM

PM

Samsung

S2MPS16

Power Management

PM

TI

BQ25890

Fast Charger

PM

TI

BQ25892

Fast Charger

RF

SKYWORKS

SKY77807-8

Quad-Band Power Amplifier Module for FDD/TDD LTE (Tx Bands 7, 38, 40, 41)

RF

SKYWORKS

SKY77646-51

Multimode Multiband Power Amplifier Module for Quad-Band GSM/EDGE –Bands (1, 25, 3, 4, 26, 8, 13, 12, 20, 28, 34, and 39) WCDMA / HSDPA / HSUPA / HSPA+ / LTE

RF

NXP

PN66T

NFC Controller

RF

Broadcom

BCM43455XKUBG

5G WiFi/BT

RF

SAMSUNG

SHANNON935

RF transceiver

RF

Broadcom

BCM47531A1

Integrated Monolithic GPS、GLONASS、BeiDou and QZSS Receiver IC

RF

MURATA

Unknown

Switch

RF

Skyworks

SKY13596-397LF

0.4 to 3.8 GHz DPDT Switch

RF

RFMD

RF1656

SP6T Switch

Sensor

Sensor

AKM

AK09911

Sensor

STMicroelectronics

LSM6DS3

6-axis Gyroscope and Accelerometer

Sensor

Unknown

Unknown

Hall Effect IC

總結:

整機外殼包括側鍵及SIM卡槽都為金屬材質,後蓋帶有CD紋的攝像頭保護蓋。整機通過底部兩顆螺絲固定。各接口及振動器位置都採用金屬蓋固定,金屬蓋內側貼有防震海綿。振動器貼有防震海綿。在光感距感模塊同樣帶有硅膠保護套。

產品技術分析服務:

一:整機分析報告:產品技術亮點、參數信息、包裝規格、整機外觀、拆解步驟、主板/軟板分析、電池/攝像頭/顯示屏分析、成本參考信息。

二:IC器件分析報告:封裝級分析、器件工藝分析、材料結構分析、可靠性/失效實驗。


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