Logic
Media Tek
MT6757V
Helio P25 8-Core ARM Cortex-A53 64-bit Application Processor and Baseband Processor
Memory
Samsung
KM3H6001CM
6GB LPDDR4X DRAM+64 GB Flash
PM
Media Tek
MT6355W
Power Management
PM
TI
BQ25890
RF
Skyworks
SKY77643-31
supports WCDMA, High-Speed Downlink Packet Access (HSDPA), High Speed Uplink Packet Access (HSUPA), High Speed Packet Access (HSPA+), and TD-SCDMA modulations
RF
Skyworks
SKY13418-485LF
0.1-3.0GHz SP8T Antenna Switch
RF
Skyworks
SKY77916-11
SkyLiTE Tx-Rx FEM for Quad-Band GSM / GPRS / EDGE w/ 14 Linear TRx Switch Ports, Dual-Band TD-SCDMA, and TDD LTE Band 39
RF
Skyworks
SKY12235-114
High IIP3 1.4 to 2.4 GHz Voltage-Controlled Variable Attenuator
RF
Media Tek
MT6167V
RF Transceivere
RF
Media Tek
MT6625LN
Wi-Fi,Bluetooth,GPS,FM
RF
Skyworks
N/A
Antenna Switch
Sensor
STK
N/A
ALS/Proximity Sensor
Sensor
InvenSense
ICM-20608
6-Axis (Gyroscope+Accelerometer)
總結:
金立S10是首款採用前後雙攝,四攝像頭的手機,整機重量達178g。S10使用底部六角螺絲加卡扣的方式固定後殼與機身。內部使用12顆十字螺絲固定內部組件。三選二卡託設計,卡託上有方向標識,取卡針孔處帶有伸縮固定栓。後殼頂部和底部採用U型隱藏天線設計,表面採用絲滑噴漆工藝。前後攝像頭模組由歐菲光提供,採用分體分連接器結構。使用鋰離子電池,電池由欣旺達生產,電芯來自ATL。5.5英寸IPS屏幕使用In-cell全貼合技術,用黑色黏膠固定,屏幕由天馬提供。正面指紋識別器從屏幕正面安裝,用一顆十字螺絲固定在內支撐板上,模組由Crucial Tec生產,由匯頂科技提供指紋識別方案。聽筒模塊和一體揚聲器模塊由AAC瑞聲科技提供。3.5毫米耳機孔使用軟排線直接與主板鏈接。
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