Logic
Media Tek
MT6757V
Helio P25 8-Core ARM Cortex-A53 64-bit Application Processor and Baseband Processor
Memory
Samsung
KM3H6001CM
6GB LPDDR4X DRAM+64 GB Flash
PM
Media Tek
MT6355W
Power Management
PM
TI
BQ25890
5A Fast Charger MaxCharge(TM) Technology for High Input Voltage and Adjustable USB OTG BoostRF
Skyworks
SKY77643-31
supports WCDMA, High-Speed Downlink Packet Access (HSDPA), High Speed Uplink Packet Access (HSUPA), High Speed Packet Access (HSPA+), and TD-SCDMA modulations
RF
Skyworks
SKY13418-485LF
0.1-3.0GHz SP8T Antenna Switch
RF
Skyworks
SKY77916-11
SkyLiTE Tx-Rx FEM for Quad-Band GSM / GPRS / EDGE w/ 14 Linear TRx Switch Ports, Dual-Band TD-SCDMA, and TDD LTE Band 39
RF
Skyworks
SKY12235-114
High IIP3 1.4 to 2.4 GHz Voltage-Controlled Variable Attenuator
RF
Media Tek
MT6167V
RF Transceivere
RF
Media Tek
MT6625LN
Wi-Fi,Bluetooth,GPS,FM
RF
Skyworks
N/A
Antenna Switch
Sensor
STK
N/A
ALS/Proximity Sensor
Sensor
InvenSense
ICM-20608
6-Axis (Gyroscope+Accelerometer)
/<tbody>/<table>总结：
金立S10是首款采用前后双摄，四摄像头的手机，整机重量达178g。S10使用底部六角螺丝加卡扣的方式固定后壳与机身。内部使用12颗十字螺丝固定内部组件。三选二卡托设计，卡托上有方向标识，取卡针孔处带有伸缩固定栓。后壳顶部和底部采用U型隐藏天线设计，表面采用丝滑喷漆工艺。前后摄像头模组由欧菲光提供，采用分体分连接器结构。使用锂离子电池，电池由欣旺达生产，电芯来自ATL。5.5英寸IPS屏幕使用In-cell全贴合技术，用黑色黏胶固定，屏幕由天马提供。正面指纹识别器从屏幕正面安装，用一颗十字螺丝固定在内支撑板上，模组由Crucial Tec生产，由汇顶科技提供指纹识别方案。听筒模块和一体扬声器模块由AAC瑞声科技提供。3.5毫米耳机孔使用软排线直接与主板链接。