全球首款用於手機毫米波晶片組:高通WiGig晶片組

• Yield hypotheses

• Die cost analyses: Baseband processor, RFIC

- Front-end cost

- Wafers and die costs

• Baseband and Antenna SiP Package cost analysis

- Baseband and antenna SiP front-end cost

- Baseband and antenna SiP cost by process step

• Final test cost

• Final assembly

• Component cost

Estimated Price Analysis

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