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飛機窗現有典型設計：
The typical design of existing aircraft window:
現有缺陷：
Technology and Defects:
1．密封膠老化/開裂。
1. Moisture Seal Erosion/Cracking.
2．水分侵入。
2. Moisture Ingression.
3．中間層降解。
3. Interlayer Degradation.
4．分層。
4. Delamination.
5．變色。
5. Discoloration.
6．母線和加熱膜弧。
6. Bus Bar and Heating Film Arcing.
7．起泡。
7. Bubbles.
8．玻璃層斷裂。
8. Glass Ply Fracture.
9．爆邊。
9. Peel Chip.
……
1．密封膠老化/開裂：
1. Moisture Seal Erosion/Cracking:
外置密封是防止水分強行進入層合玻璃的基礎屏障。
Outboard (outer) moisture seal is the primary barrier to prevent moisture from entering the laminate.
密封老化、開裂主要是由於風、雨對外露密封膠的侵蝕所致。
Moisture seal degradation is due primarily to wind /rain erosion of the outboard seal / sealant material.
2．水分侵入：
2. Moisture Ingression:
這雖不是一個結構性問題，如果水分一旦滲入，則會引發透明件層合間的降解、分層、電加熱系統損壞等故障，減少窗總成的使用壽命。
While not a structural issue, if moisture ingress is present, delamination, interlayer degradation, and electric heating system damage / failure can occur reducing the service life of the window.
3．中間層降解：
3. Interlayer Degradation:
由於外部防水密封失效，滲入的水分與氨基甲酸酯和乙烯基相互作用，可能發生層合間的降解、失效。
Degradation of the interlayer may occur due to failure of the outboard moisture seal allowing moisture to interact with the urethane and vinyl.
透明的聚氨酯夾層，由於水分滲入，會轉變成白色、乳白色等半透明狀。
Urethane interlayer appearance may change from clear to a white, milky, translucence due to moisture ingress.
聚氨酯持續處於滲入的水分中，會降解，形成“龜裂”。
Continued exposure to moisture will cause degradation of the urethane creating a “mud-cracking” appearance.
清晰的基層，由於水分侵入，也會變得渾濁；水分侵入可能還會出現層合分層或脫粘故障。
PVB / AG vinyl interlayer may also change from clear to a milky / cloudy appearance due to moisture ingress. Delamination or debonding may occur.
4．分層：
4. Delamination:
層合分層問題可能會發生在透明件邊沿的各層合間清晰的分層。
Delamination is the separation of the interlayer from any of the glass plies contained in the window.
層合玻璃間明確、完全的分離模糊的分層。
Clear - complete separation/ de-bonding of interlayer from glass or plastic substrate.
層合玻璃間有水分、溼氣滲入後邊界模糊的分離。
Cloudy - moisture present.
5．變色：
5. Discoloration:
沿加熱系統母線內邊緣部可見的電源引線，發生黑色或深棕色的變色，或出現導電加熱膜的電弧，這是一個需要將窗總成拆解維修或更換才能排除的故障。
Black or dark brown discoloration along the inside edge of the heating system bus bar, internally visible power lead wires, or on the electrically conductive heating film is an indication of arcing and should be regarded as a potential removal for replacement.
線路斷開（導致連不到）。
Open circuit-broken wire (cause for removal).
出現銀紋/ 降解龜裂。
Cracking / crazing (not a cause for removal unless impairs pilot’s vision).
6．加熱系統故障：
6. Heating System Failure:
母線/導電膜弧。
Bus Bar/Conductive Film Arcing.
元件傳感故障。
Sensing Element Failure.
擋風玻璃的熱控制器故障。
Windshield Heat Controller Failure.
導線/終端塊弧。
Power Lead Wire / Terminal Block Arcing.
7．起泡：
7. Bubbles:
由於過熱狀態引發夾層內形成小氣泡。
Overheat condition.
由擋風玻璃緊固件扭應力引發夾層內形成小氣泡。
Over torquing of windshield fasteners.
由夾緊壓力引發夾層內形成小氣泡。
Clamping pressure Small bubbles may form within the interlayer.
夾層起泡是一個結構性問題。
Bubbles in the interlayer are a structural issue.
夾層起泡是由於夾緊壓力造成的。這種類型的起泡通常發生在視覺領域的邊緣和局部，是夾緊壓力或安裝緊固件扭力作用於擋風玻璃周邊的結果。
Bubbles in the interlayer may also be caused by clamping pressure. This type of bubbling typically occurs near the edge of the vision area and is the result of localized clamping pressure or over torquing the mounting fasteners around the periphery of the windshield.
8．玻璃破裂：
8. Glass Fracture:
層合玻璃開裂或破碎可能發生在層合間的任何玻璃層。
Glass fracturing or cracking can occur on any of the glass plies.
當處於運行振動中的窗總成，若有異物損傷、外力衝擊、表面劃痕、層合分層、電弧、端頭爆邊、過熱、粘附力不均等情形時，可導致玻璃破裂。
Glass fracture can result from foreign object damage (FOD) impact / impingement, surface scratches, overheat condition, electrical arcing or peel / adhesion chip.
9．爆邊：
9. Peel Chip:
擋風玻璃爆邊通常形成於寒冷地區。
Peel chips usually form in cold area(s) of the windshield.
玻璃爆邊只會發生在對疊玻璃的端頭。
Peel chips will occur only on the laminated surface(s) of the glass ply.
玻璃爆邊具有鋸齒狀的進展線，振動作用使得爆邊變得越來越大、越寬。
Peel chips exhibit jagged progression lines as the chip grows becoming larger / wider.
玻璃爆邊通常由塑料或玻璃纖維樹脂在玻璃表面局部的過度粘附造成。
Created by local excessive adhesion at glass surface, usually from vinyl or fiberglass resin.
玻璃爆邊會形成鋒利的V形。
Creates sharp “V”shape peel chip.
由機械振動、扭應力導致爆邊延展，進而引發玻璃自發性斷裂故障。
Chip propagates, or ‘peels’ with thermal or mechanical stress until spontaneous fracture occurs.
來源：航遊視界
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關鍵字: 水分 interlayer Moisture
